University of Colorado at Boulder and |
|Electrical and Computer Engineering||Electrical Engineering and Computer Science|
|Ms. Yonghong Yang||Mr. Zhenyu Gu|
|Mr. Changyun Zhu||Prof. Robert Dick|
|Prof. Li Shang|
Increasing integrated circuit (IC) power density can result in high temperature, reducing reliability, reducing performance performance, increasing leakage power consumption, and increasing the cost of economical cooling. The use of thermal analysis during early stages of the IC design can enable temperature optimization techniques that would be impractical if thermal analysis were deferred until packaging design. Many methods of integrated circuit thermal analysis do not have sufficient performance and accuracy for use in architectural design.
ISAC is an IC chip-package thermal analysis software package based on Spatially-adaptive and temporally-adaptive numerical analysis techniques.
Acknowledgments: This work was supported in part by the Natural Science and Engineering Research Council under Discovery Grant #388694-01, in part by the National Science Foundation under awards CNS-0347941 and CCF-0702761, and in part by the Semiconductor Research Corporation under Awards 2007-HJ-1593 and 2007-TJ-1589.
Page maintained by Robert Dick and Li Shang.